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Joint Strength
JIS
This is a 45-degree pull test of solder joints on QFP Lead complying with JIS Z3198-6 (2003) [Test methods for lead-free solders – Part 6: Method for 45 pull test of solder joints on QFP lead] (corresponding part only). JIS Z3198-6 (2003) defines the fixing angle and test speed during measurement. The board fixing stage can be switched between 45 degrees and 90 degrees and the test speed can be set digitally on the motorized test stand for easy setting and testing without complicated operations. Other solutions for chip shear strength testing based on JIS and IEC standards are also available.
inquiry number
3H2005A
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JIS Z3198-6 [ 2003 ] [Test methods for lead-free solders – Part 6:Method for 45 pull test of solder joints on QFP lead] (corresponding part only)
This video shows the testing image of objective sample. Some samples may not be suitable to measure with this configuration depending on their materials or shapes.
The example of product configuration is for your reference only. It varies depending on sample, measurement method and testing capacity.
The products used in this video may differ from the example of product configuration.
Please select the right product model for the product configuration. Refer to the specification of each product for the compatibility.
Convenient Unit/Torque/
Tension conversion
6 Significant Digits (*Significant digits are meaningful digits that do not include zeros, which are used to indicate the scale.)
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