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90 degree Peel
IEC
Graph
This peel off test of flexible printed circuit complying with IEC 326-2: 1990 [Printed boards Part2: Test Method] (corresponding part only) and IEC 249-1 (1982) [Base Materials for printed circuits Part1: Test Method](corresponding part only) measures the adhesive strength when the flexible printed circuit board is peeled off. Flexible printed circuit boards are used in various electronic devices. Its thinness and flexibility contribute to space saving and weight reduction, and the demand continues to grow. The motorized test stand and software deliver efficient testing according to standards.
inquiry number
3P2009A
Present the “inquiry number” below when you contact us, for prompt assistance.
IEC 249-1 [ 1982 ] [Base Materials for printed circuits Part1: Test Method](corresponding part only)
IEC 326-2 [ 1990 ] [Printed boards Part2: Test Method] (corresponding part only)
This video shows the testing image of objective sample. Some samples may not be suitable to measure with this configuration depending on their materials or shapes.
The example of product configuration is for your reference only. It varies depending on sample, measurement method and testing capacity.
The products used in this video may differ from the example of product configuration.
Please select the right product model for the product configuration. Refer to the specification of each product for the compatibility.
Convenient Unit/Torque/
Tension conversion
6 Significant Digits (*Significant digits are meaningful digits that do not include zeros, which are used to indicate the scale.)
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