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  Fixtures Software / Download Card Cables 180 Degree Peel Testers Food Texture Analyzer & Related Wire Crimp Pull Testers Other Equipment Custom Made Discontinued Products
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Chip Components Tension/Shear Test Attachment

Chip Components Tension/Shear Test Attachment Overview QFP Lead Hook/Chip Shear Jig Chip Peel Fixture Alignment Stage for Solder Joint Strength Test

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Force Measurement IMADA
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Chip Components Tension/Shear Test Attachment

Chip Components Tension/Shear Test Attachment

Attachment for lead-free solder test is a jig to measure exclusively shear and peel strength of soldered/glued electronic components.

Recently, lead-free solder has been increasingly used to comply with RoHS and other directives. Furthermore, while components have become smaller and denser, they are also required to be more durable and reliable.

JIS standards related to lead-free solder testing have also appeared, and inquiries are increasing. The jigs introduced here are specially designed for lead-free solder tests that require delicate lead-free soldering such as QFP leads and chip components, and can also perform lead-free solder tests in accordance with related JIS standards.

Check the product, the details and view a video of a lead-free solder test.

QFP Lead Hook/Chip Shear Jig

SJ series

QFP Lead Pull Test

Solder Joint Test

Chip Shear Test

Lo-Mid Force

SJ series is QFP lead hook/Chip shear jig with 100N capacity for solder joint strength test. 5 types are available to meet your testing requirements. It complies with the corresponding part of IEC and JIS standards.

For more info

Chip Peel Fixture

GT-10/20

Chip Peel Test

Simple Test

Light Weight

Lo-Mid Force

GT-10/20 is chip peel fixture with 500N capacity. It is suitable for low capacity measurement in narrow space due to compact and light-weight design. It is ideal for peel (shear) testing of electric components.

For more info

Alignment Stage for Solder Joint Strength Test

SJS-100N-L/S

Fixing PCBs

45/90 deg switchable

Lo-Mid Force

SJS-100N-L/S is alignment stage with 100N capacity for solder joint strength test of QFP lead (lead free solder) or IC chips. It allows easy and fine position adjustment of tiny parts. The stage angle is switchable to 45 or 90 degrees.

For more info